Tezzaron Semiconductor Careers in Chicago, IL

Tezzaron® Semiconductor Corporation specializes in 3D wafer stacking and TSV processes, die-on-wafer stacking, 3D memory elements, high-speed memory products, and other innovations that propel the semiconductor industry toward higher performance and greater profitability. The company demonstrated the world's first successful wafer-stacked 3D-ICs back in 2004, including stacked microprocessors, stacked sensors, and stacked SRAM devices. Processing has since been refined and extended, yielding an ongoing stream of unique and functional designs. Tezzaron's rapidly expanding customer base includes government, academic, and commercial organizations. Custom 3D-ICs are built at several technology nodes. Prototypes are built on multi-project wafers (MPWs) that allow affordable entry to this exciting new technology. See more at our website: http://www.tezzaron.com/ Specialties Memory Devices, 3D ICs, Advanced Technologies