About Quik-Pak
Quik-Pak, a division of Delphon Industries, specializes in advanced IC Assembly and quick-turn Prototyping Services for semiconductor companies, enabling faster time to market for new devices. The unique assembly requirements for Flip Chip, Chip-on-Board (COB), Stacked Die, Multi-Chip Module (MCM), System-in-Package (SIP), Ceramic, BGA and MEMs devices are addressed by Quik-Pak’s flexible processes and equipment, delivering prototypes to specification and on schedule. Quik-Pak provides custom laminate substrate services, from design and fabrication to final assembly. Specialties IC Packaging, IC Assembly, Microelectronic Packaging, Assembly Solutions
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